发明名称 BEZEL PACKAGING OF FRIT-SEALED OLED DEVICES
摘要 Methods and assemblies relate to bezel packaging of a sealed glass assembly, such as a frit-sealed OLED device. The bezel packaging includes a shock absorbent intermediate layer of low modulus of elasticity material applied between the sealed glass assembly and the bezel. A bonding agent, which may include the low modulus of elasticity material and/or a separate bonding material, affixes the sealed glass assembly to the bezel. Bezel modifications may be made to stabilize the bezel. Exemplary bezel modifications include reinforced bezel side walls and supporting straps attached between bezel walls. The bezel design may include a gap between the edges of the sealed glass assembly and the bezel walls, so as to avoid direct contact therewith. The gap may be filled at least in part with low modulus of elasticity organic adhesive to provide additional shock absorbency. The low modulus of elasticity material may include foam, ceramic fiber cloth and/or a low modulus of elasticity polymeric organic coating.
申请公布号 EP2084082(A1) 申请公布日期 2009.08.05
申请号 EP20070776991 申请日期 2007.05.11
申请人 CORNING INCORPORATED 发明人 BAYNE, JOHN F.;WESTBROOK, JAMIE T.;WIDAJA, SUJANTO
分类号 B65D81/05;B65D85/48;C03C27/04;H01L51/52 主分类号 B65D81/05
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