发明名称 |
Method for fabricating semiconductor device |
摘要 |
A method for fabricating a semiconductor device capable of preventing a device failure is provided. The method includes: forming an insulating layer with a contact hole on a semiconductor substrate; forming a seed layer on the contact hole through electroless plating process; and forming a metal interconnection in the contact hole on the seed layer.
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申请公布号 |
US7569479(B2) |
申请公布日期 |
2009.08.04 |
申请号 |
US20060636307 |
申请日期 |
2006.12.08 |
申请人 |
DONGBU ELECTRONICS CO., LTD. |
发明人 |
KIM JAE HONG |
分类号 |
H01L21/4763 |
主分类号 |
H01L21/4763 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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