WIRE FOR SEMICONDUCTOR PACKAGE

摘要

A wire of various cross sections for the semiconductor package is provided to reduce deformation fault by increasing bending stiffness. The wire(10-16) has a cross-section of polygonal in order to increase the resistance against a bending stress generated in the resin molding. The main cross-sectional configuration of the wire is a circular. A plurality of protruded parts(12a) is protruded with the fixed angle on the circumference of the principal section. The protruded part is formed along the longitudinal direction as a band shape. The polygonal cross-section form is one among a triangle, square, pentagon, hexagon and octahedral.