SURFACE MOUNTABLE INTEGRATED CIRCUIT PACKAGING SCHEME,申请号IL20080194823-传众专利搜索

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发明名称	SURFACE MOUNTABLE INTEGRATED CIRCUIT PACKAGING SCHEME
摘要
申请公布号	IL194823(D0)	申请公布日期	2009.08.03
申请号	IL20080194823	申请日期	2008.10.22
申请人	SIBEAM, INC.	发明人
分类号	H01R	主分类号	H01R
代理机构		代理人
主权项
地址

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