发明名称 |
MICROELECTRONIC DEVICES AND METHODS FOR FORMING INTERCONNECTS IN MICROELECTRONIC DEVICES |
摘要 |
Microelectronic devices, methods for packaging microelectronic devices, and methods for forming interconnects in microelectronic devices are disclosed herein. In one embodiment, a method comprises providing a microelectronic substrate having a front side and a backside. The substrate has a microelectronic die including an integrated circuit and a terminal operatively coupled to the integrated circuit. The method also includes forming a passage at least partially through the substrate and having an opening at the front side and/or backside of the substrate. The method further includes sealing the opening with a conductive cap that closes one end of the passage while another end of the passage remains open. The method then includes filling the passage with a conductive material.
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申请公布号 |
US2009191701(A1) |
申请公布日期 |
2009.07.30 |
申请号 |
US20090419029 |
申请日期 |
2009.04.06 |
申请人 |
MICRON TECHNOLOGY, INC. |
发明人 |
KIRBY KYLE K.;AKRAM SALMAN;HEMBREE DAVID R.;RIGG SIDNEY B.;FARNWORTH WARREN M.;HIATT WILLIAM M. |
分类号 |
H01L21/768;H01L21/44;H01L21/4763;H01L23/48;H01L23/52;H01L29/40;H05K1/03;H05K3/40;H05K3/42 |
主分类号 |
H01L21/768 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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