发明名称 |
SOLID-STATE IMAGING DEVICE, MANUFACTURING METHOD FOR THE SAME, AND IMAGING APPARATUS |
摘要 |
A solid-state imaging device having a light-receiving section that photoelectrically converts incident light includes an insulating film formed on a light-receiving surface of the light-receiving section and a film and having negative fixed charges formed on the insulating film. A hole accumulation layer is formed on a light-receiving surface side of the light-receiving section. A peripheral circuit section in which peripheral circuits are formed is provided on a side of the light-receiving section. The insulating film is formed between a surface of the peripheral circuit section and the film having negative fixed charges such that a distance from the surface of the peripheral circuit section to the film having negative fixed charges is larger than a distance from a surface of the light-receiving section to the film having negative fixed charges.
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申请公布号 |
US2009189235(A1) |
申请公布日期 |
2009.07.30 |
申请号 |
US20080339941 |
申请日期 |
2008.12.19 |
申请人 |
SONY CORPORATION |
发明人 |
IKEDA HARUMI;HIYAMA SUSUMU;ANDO TAKASHI;TABUCHI KIYOTAKA;YAMAGUCHI TETSUJI;OHGISHI YUKO |
分类号 |
H01L31/10;H01L27/146;H01L27/148;H01L31/00;H01L31/0232;H01L31/18;H04N5/335;H04N5/361;H04N5/369 |
主分类号 |
H01L31/10 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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