| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of manufacturing a multilayer substrate with improved working accuracy of patterns formed by using liquid drops. SOLUTION: Before a drawing step, a groove CH having the same shape as a liquid wiring pattern PL drawn on the drawing surface 20a of a green sheet 23 in the drawing step is formed. In the drawing step, the liquid wiring pattern PL is drawn in the groove CH. In a drying step, the liquid wiring pattern PL drawn in the groove CH is formed into a dry wiring pattern, and an aggregate of conductive particulate Ia is accommodated and arranged in the groove CH. Even if the pressing force from the adjacent green sheet 23 is applied to the green sheet 23 with the dry wiring pattern formed in a laminating step, a decompressing/packaging step, a compression bonding step, etc., the direct force is less likely to be applied to the aggregate of the conductive particulate Ia since the aggregate of the conductive particulate Ia is accommodated and arranged in the groove CH. COPYRIGHT: (C)2009,JPO&INPIT |
