发明名称 CRYSTAL DEVICE AND MANUFACTURING METHOD FOR CRYSTAL DEVICE
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a crystal device in which sealer filled into a through-hole is melted and spread to all the corners of the through-hole to maintain airtightness inside a package. <P>SOLUTION: A crystal device 100 comprises a crystal frame 50 including a crystal vibration chip 30 with an electrode pattern and an outer frame 51 supporting the crystal vibration chip, connecting electrodes 42 and 44 formed on a first face, and external electrodes 45 and 46 formed on a second face opposite to the first face and conducted to the connecting electrode. In addition, the crystal device 100 comprises a crystal base 40 of which the first face couples to the crystal frame 50, and a crystal lid 20 coupled to the crystal frame 50 on a face opposite to the crystal base 40. Through electrodes 41 and 43 for conducting the connecting electrodes 42 and 44 to the external electrodes 45 and 46 have a non-circular section. <P>COPYRIGHT: (C)2009,JPO&INPIT</p>
申请公布号 JP2009171080(A) 申请公布日期 2009.07.30
申请号 JP20080005228 申请日期 2008.01.15
申请人 NIPPON DEMPA KOGYO CO LTD 发明人 SAITO TAKESHI
分类号 H03H9/02;H01L23/02;H03H3/02 主分类号 H03H9/02
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