APPARATUS AND METHOD FOR FORMING THREE-DIMENSIONAL CIRCUIT BOARD

摘要

PROBLEM TO BE SOLVED: To provide an apparatus and a method for forming a three-dimensional circuit board for adhering a circuit board with higher positional accuracy particularly to the entire part of circumference of the front surface of a column-shaped or cylindrical roller to provide the minimum and shallowest gap. SOLUTION: The apparatus has: a rotating mechanism (10) for holding a column-shaped or cylindrical object (1) in the state in which the center axis becomes horizontal and for rotating the object around the center axis as the rotating axis; a holding mechanism (20) for holding the object in the state in which a bonding agent layer exposing a bonding agent film with separator placed in the lower side and for carrying horizontally the object; and a control mechanism (30) for adjusting the relative positional relationship to place the bonding agent film with separator or the circuit board (2) to be carried in contact with the front surface of the rotating object (1) and for controlling a pressure toward the front surface of the object (1) to a constant value. COPYRIGHT: (C)2009,JPO&INPIT