| 摘要 |
PROBLEM TO BE SOLVED: To maintain a pad portion in a state wherein it is stably bonded to a substrate. SOLUTION: A circuit board is provided which has a circuit pattern formed on the substrate by printing and including a wiring portion and a pad portion connected to the wiring portion and having larger area than the wiring portion, and also which has a cover coat layer formed, by printing, partially covering an upper surface of the pad portion and extending to the substrate side across at least some edge, and made of an adhesive material. COPYRIGHT: (C)2009,JPO&INPIT
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