| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a cutting device capable of dividing a plate-like material into a plurality of pieces and chamfering corner parts of the divided small sized substrates. <P>SOLUTION: This cutting device is provided with a rotatable chuck table for holding the plate-like material and a cutting means mounted with a cutting blade for dividing the plate-like material held on the chuck table into the small pieces. The chuck table is provided with a plurality of small piece suction tables for sucking and holding the plurality of small pieces of plate-like materials divided by cutting the plate-like material and a collection and separation means connected to each of the small piece suction tables to collect each small piece suction table at a mutually contacting position and to mutually separate each small piece suction table. <P>COPYRIGHT: (C)2009,JPO&INPIT</p> |
