FILM TYPE TRANSFER MATERIAL

摘要

Disclosed is a film type photosensitive transfer material including a base film, a resin protective layer, a photosensitive resin layer and a cover film, in which the resin protective layer has adhesion of 0.005 kgf /cm2 or less. When the film type photosensitive transfer material is applied on a printed circuit board, it is possible to perform an exposure process in a state in which a base film is removed, and thus an interval between a mask and a photosensitive resin layer can be narrowed in the exposure process, thereby improving the resolution of a pattern. The film type photosensitive transfer material allows the base film to be removed before the exposure process, and can be processed in sheets or can be applied to a roll-to-roll process.