| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor device which is made compact and stably operates. <P>SOLUTION: The semiconductor device is a semiconductor device having a plurality of chips sealed in one package, and includes a die pad 500, an A/D converter 100 which is mounted on the die pad 500 and has a circuit for conversion from an analog signal to a digital signal, an image processor 200 which is mounted on the die pad 500 and has a circuit for processing at least the digital signal, a wire 700B connecting the A/D converter 100 and image processor 200 to each other to transmit the digital signal between the A/D converter 100 and image processor 200, and a sealing resin 900 sealing the A/D converter 100 mounted on the die pad 500 and an MCU 200. <P>COPYRIGHT: (C)2009,JPO&INPIT |
