发明名称 RELIABILITY EVALUATION METHOD OF ELECTRONIC COMPONENT MOUNTING BOARD
摘要 PROBLEM TO BE SOLVED: To provide a simple method for evaluating the reliability of insulation on ion migration, especially on the migration of a chlorine ion which is generated when a voltage is applied on an electronic component mounting board where wiring is formed on an insulating base material. SOLUTION: The whole or a part of a wiring region of an electronic component mounting board is coated with resin such as an epoxy resin containing 1-100 mass ppm of chlorine and a voltage is applied between wiring, and after that, the discoloration of wiring is determined visually. Preferably, a voltage is applied to wiring for test at a temperature of 60-125°C and at the relative humidity of 60-95% RH. For wiring, a pair of comb-shaped wiring 10a and 10b facing each other and having a plurality of comb-shaped conductors 2a and 2b alternately arranged are preferably used. COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2009170742(A) 申请公布日期 2009.07.30
申请号 JP20080008706 申请日期 2008.01.18
申请人 SUMITOMO METAL MINING CO LTD 发明人 ASAKAWA YOSHIYUKI
分类号 H05K3/00;G01N21/84;G01N21/956;H01L23/12 主分类号 H05K3/00
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