| 摘要 |
PROBLEM TO BE SOLVED: To provide a pasting apparatus of a substrate body and a treating method of the substrate body, in which the rigidity of the substrate body can be ensured and there is no need to install a large-scale equipment and the like. SOLUTION: A supplying stage 1, a pasting stage 10, and a handling mechanism 30 are built in a portable case, and the supplying stage 1 and the pasting stage 10 are arranged in a line. Between these supplying stage 1 and pasting stage 10, a semiconductor wafer which forms the substrate body, a substrate holder, and the substrate holder which removably holds the semiconductor wafer are optionally handled by a hand 32 of the handling mechanism 30. Since a rigid substrate holder 22 is used, various treatments can be performed by easily giving the rigidity to the semiconductor wafer, and the semiconductor wafer can be handled and can be transferred. COPYRIGHT: (C)2009,JPO&INPIT
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