| 摘要 |
PROBLEM TO BE SOLVED: To provide a material for forming a low-resistance extra-fine conductive pattern having a dense film condition and small surface roughness; a conductive pattern formation method; and a wiring board. SOLUTION: This conductive pattern formation material comprises a combination of a first material 1 prepared by dispersing and mixing first conductive particles in a mixture of a thermally-degradable polymer material and a solvent, and a second material 2 prepared by dispersing second conductive particles with particle sizes smaller than those of the first conductive particles in a dispersion medium, and in the first material 1, the ratio of the weight of the first conductive particles to that of the thermally-degradable polymer material is 10:1 to 100:1. COPYRIGHT: (C)2009,JPO&INPIT
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