发明名称 |
Photosensitive Resin Composition and Photosensitive Film |
摘要 |
Disclosed is a photosensitive resin composition comprising an alkali-soluble resin, wherein the dissolution rate of the alkali-soluble resin in an aqueous sodium carbonate solution is not less than 0.04 mum/sec. When a photosensitive layer having a thickness of 30 mum is formed by applying the photosensitive resin composition onto a base and removing the solvent by heating, and thus-obtained photosensitive layer is irradiated with an active ray of 1000 mJ/cm2 or less, the dissolution rate of the portion irradiated with the active ray in the photosensitive layer made of the photosensitive resin composition is not less than 0.22 mum/sec and the film residual rate of the portion not irradiated with the active ray is not less than 90%.
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申请公布号 |
US2009191385(A1) |
申请公布日期 |
2009.07.30 |
申请号 |
US20070226227 |
申请日期 |
2007.04.24 |
申请人 |
ASAHI KASEI KABUSHIKI KAISHA |
发明人 |
MIYAZAKI KUON;HAYAKAWA TAKASHI |
分类号 |
B32B3/10;G03F7/039;G03F7/20 |
主分类号 |
B32B3/10 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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