| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a semiconductor module excelling in heat radiation performance. <P>SOLUTION: This semiconductor module 1 is formed by incorporating semiconductor elements 2 therein, and arranging heat radiator plates 3 on a pair of principal surfaces. A first heat radiator plate 31 being one-side heat radiator plate out of the pair of heat radiator plates 3 has a rectangular shape, and a second heat radiator plate 32 being the other heat radiator plate out of the pair of heat radiator plates 3 has a shape provided with cutout parts 321 at least at two diagonal corner parts out of four corners in a rectangular shape identical with that of the first heat radiator plate 31. <P>COPYRIGHT: (C)2009,JPO&INPIT</p> |
