PHOTOSENSITIVE ADHESIVE COMPOSITION, FILM-LIKE ADHESIVE, ADHESIVE SHEET, ADHESIVE PATTERN, SEMICONDUCTOR WAFER WITH ADHESIVE LAYER, SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a photosensitive adhesive composition which is excellent in patterning ability by the use of an alkali developing liquid, has satisfactory thermo-compression adhesiveness even after patterning, is excellent in heat resistance after adhesion and is also excellent in low-temperature pasting ability when the adhesive composition is formed into a film shape. SOLUTION: The photosensitive adhesive composition comprising an alkali-soluble resin (A), a dihydropyridine derivative (B) and an epoxy resin (C) is molded into a film-like adhesive 1, wherein a flow amount when the film-like adhesive is compressed at 0.2 MPa for 60 sec while being heated at 180°C is at least 200 μm. COPYRIGHT: (C)2009,JPO&INPIT