发明名称 |
APPARATUS AND METHOD FOR SURFACE TREATMENT WITH PLASMA IN ATMOSPHERIC PRESSURE HAVING PARALLEL PLATES TYPE ELECTRODE STRUCTURE |
摘要 |
An atmospheric pressure plasma surface processing apparatus having a parallel flat type electrode structure and a surface processing method thereof are provided to process efficiently surfaces of chemical active species by preventing damage due to charged particles. An atmospheric pressure plasma surface processing apparatus(100) having a parallel flat type electrode structure includes a power electrode and lower grounding electrodes(31,32). The power electrode receives a voltage. The lower grounding electrodes are installed under the power electrode. The lower grounding electrodes are opposite to the power electrode in order to form lower plasma generation spaces(41,42). A plurality of outlets(53) are formed at the lower grounding electrodes in order to discharge the plasma and the processing gas. The thickness of the lower grounding electrode is 3-50mm. |
申请公布号 |
KR20090081828(A) |
申请公布日期 |
2009.07.29 |
申请号 |
KR20080007915 |
申请日期 |
2008.01.25 |
申请人 |
KOREA BASIC SCIENCE INSTITUTE;SEMTECHNOLOGY CO., LTD. |
发明人 |
LHO, TAI HYEOP;SEOK, DONG CHAN;YOO, SEUNG RUL |
分类号 |
H05H1/24;H05H1/34;H05H1/46 |
主分类号 |
H05H1/24 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|