| 摘要 |
A method for manufacturing a high capacity memory chip card is provided not to generate an empty space between a resin sealing portion and a sheet even when a high capacity memory chip with a large size is mounted. The chip film inserting hole of a size corresponding to the size of the chip film part of a high capacity memory chip module(80) is punched in a front sheet(10,20). The resin sealing portion inserting hole(11) of a size corresponding to the size of a resin sealing portion(82) of the high capacity memory chip module is punched in a core sheet(30,40,50). Filler(51) is coated on a rear sheet as the size corresponding to the size of the resin sealing portion of the high capacity memory chip module(60,70). The front sheet, the core sheet, and the rear sheet are laminated. The laminated sheets are heated and pressured. The memory chip module in which glue tapes(83, 84) are adhered to a bottom surface is united with the combination of the sheets which are laminated and compressed. The united body is compressed, and a memory chip card is completed. |
