发明名称 |
Light emitting diode package |
摘要 |
A light emitting diode package which is superior in heat radiation and easily manufacturable. In the light emitting diode package, an Al substrate has a reflective cup formed thereon. At least one light emitting diode chip is disposed on a bottom surface of the reflective cup. An Al anodized film extends through the Al substrate to divide the bottom surface of the reflective cup into a plurality of substrate electrodes. Here, at least one of the substrate electrodes is surrounded by the Al anodized film. Also, the substrate electrodes are connected to a light emitting diode chip, respectively.
|
申请公布号 |
US7566912(B2) |
申请公布日期 |
2009.07.28 |
申请号 |
US20070717154 |
申请日期 |
2007.03.13 |
申请人 |
SAMSUNG ELECTRO-MECHANICS CO., LTD. |
发明人 |
LEE YOUNG KI;LEE SEON GOO;CHOI SEOG MOON;SHIN SANG HYUN |
分类号 |
H01L33/54;H01L33/56;H01L33/60;H01L33/62;H01L33/64 |
主分类号 |
H01L33/54 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|