发明名称 OPERATING METHOD OF SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING APPARATUS
摘要 An operating method for a substrate processing apparatus and the substrate processing apparatus are provided to safely and promptly open a door when abnormal operation is detected and to facilitate the collection of substrates placed in the substrate processing apparatus. A substrate processing apparatus comprises a polishing unit(3), a cleaning unit(4) and a returning unit(7,22). An operating method for the substrate processing apparatus comprises the following steps of: classifying substrates based on their location in the substrate processing apparatus when abnormal operation is detected; and performing treatment to the substrate in consideration of the abnormally operated units.
申请公布号 KR20090081339(A) 申请公布日期 2009.07.28
申请号 KR20090005413 申请日期 2009.01.22
申请人 EBARA CORPORATION 发明人 TORII HIROOMI;NISHIDA HIROAKI;KANEKO HIROYUKI;DATE MISAO;MITSUYA TAKASHI;NAKAMURA TAKAMASA
分类号 H01L21/304;B24B37/04;H01L21/02;H01L21/677 主分类号 H01L21/304
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