发明名称 |
OPERATING METHOD OF SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING APPARATUS |
摘要 |
An operating method for a substrate processing apparatus and the substrate processing apparatus are provided to safely and promptly open a door when abnormal operation is detected and to facilitate the collection of substrates placed in the substrate processing apparatus. A substrate processing apparatus comprises a polishing unit(3), a cleaning unit(4) and a returning unit(7,22). An operating method for the substrate processing apparatus comprises the following steps of: classifying substrates based on their location in the substrate processing apparatus when abnormal operation is detected; and performing treatment to the substrate in consideration of the abnormally operated units.
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申请公布号 |
KR20090081339(A) |
申请公布日期 |
2009.07.28 |
申请号 |
KR20090005413 |
申请日期 |
2009.01.22 |
申请人 |
EBARA CORPORATION |
发明人 |
TORII HIROOMI;NISHIDA HIROAKI;KANEKO HIROYUKI;DATE MISAO;MITSUYA TAKASHI;NAKAMURA TAKAMASA |
分类号 |
H01L21/304;B24B37/04;H01L21/02;H01L21/677 |
主分类号 |
H01L21/304 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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