发明名称 METHOD OF FORMING BONDED BODY AND BONDED BODY
摘要 <p>An assembled body and a method for producing the same are provided to firmly and accurately connect two base materials and to effectively assemble them even at low temperatures. A method for producing an assembled body comprises: a first step of forming copper joining layers(31,32) on a first base material and a second base material respectively using a chemical vapor deposition method; a second step of placing the copper joining layers to face each other and giving compressive force to the first and second base materials while attaching the first base material to the second base material; and a third step of assembling the copper joining layers to obtain the assembled body.</p>
申请公布号 KR20090081328(A) 申请公布日期 2009.07.28
申请号 KR20090004082 申请日期 2009.01.19
申请人 SEIKO EPSON CORPORATION 发明人 SATO MITSURU;YAMAMOTO TAKATOSHI
分类号 H01L21/02 主分类号 H01L21/02
代理机构 代理人
主权项
地址