METHOD FOR TREATING SUBSTRATE

摘要

A method for treating a substrate is provided to treat a substrate with plasma while a substrate supporting member or a plasma supply member is relatively moved into a horizontal direction. A substrate is loaded on a substrate supporting member(100) which is rotated. The substrate is treated with plasma while a plasma supply member(220) and the substrate supporting member are relatively moved into a horizontal direction. The plasma supply member supplies plasma to the top of the substrate. The plasma supply member includes a plurality of plasma generating units(230) which is parallel arranged each other.