| 摘要 |
A thin film forming device using a laser for reducing a facility cost and a facility area is provided to simplify a facility by arranging a sharing gas supplying unit and a sharing exhausting unit. A substrate in which the electrical defect of a pattern is discovered is placed. A plurality of thin film forming units uses the laser and deformity repairs. Gantry moves a plurality of thin film forming unit to the defect site. A share gas supply unit(460) supplies a plurality of thin film forming unit. A shared discharge unit exhausts the residual gas which is generated when a plurality of thin film unit.
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