发明名称 REINFORCED RESIN COMPOSITION FOR PLATED BASE MATERIAL, MOLDED PRODUCT, AND ELECTROPLATED COMPONENT
摘要 PROBLEM TO BE SOLVED: To provide a reinforced resin composition for a plated base material improving the surface appearance of a molded product after plated with high plating property besides having high moldability and mechanical strength. SOLUTION: The reinforced resin composition for the plated base material contains a mixture of 10-60 mass% of a graft copolymer A with a graft chain A2 grafted to a gum polymer A1 of specific particle diameter, 40-90 mass% of a matrix polymer B composed of one or more kinds of polymers selected from a group of a vinyl-based copolymer B-1, polycarbonate resin B-2 and polyester resin B-3, and 0.1-60 pts.mass of an inorganic filler D and 0.5-20 pts.mass of a polymer E containing glycidyl ether units to the total 100 pts.mass of the A component and B component, wherein the content of the gum polymer A1 is 5-25 mass% when the total of the A component and the matrix polymer B component is 100 mass%. COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2009155577(A) 申请公布日期 2009.07.16
申请号 JP20070338094 申请日期 2007.12.27
申请人 UMG ABS LTD 发明人 TEZUKA KOICHI;FUJIMOTO IWAO;NAKAMOTO MASAHITO
分类号 C08L55/02;C08L25/12;C08L63/00;C08L67/00;C08L69/00;C25D5/56 主分类号 C08L55/02
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