发明名称 |
REINFORCED RESIN COMPOSITION FOR PLATED BASE MATERIAL, MOLDED PRODUCT, AND ELECTROPLATED COMPONENT |
摘要 |
PROBLEM TO BE SOLVED: To provide a reinforced resin composition for a plated base material improving the surface appearance of a molded product after plated with high plating property besides having high moldability and mechanical strength. SOLUTION: The reinforced resin composition for the plated base material contains a mixture of 10-60 mass% of a graft copolymer A with a graft chain A2 grafted to a gum polymer A1 of specific particle diameter, 40-90 mass% of a matrix polymer B composed of one or more kinds of polymers selected from a group of a vinyl-based copolymer B-1, polycarbonate resin B-2 and polyester resin B-3, and 0.1-60 pts.mass of an inorganic filler D and 0.5-20 pts.mass of a polymer E containing glycidyl ether units to the total 100 pts.mass of the A component and B component, wherein the content of the gum polymer A1 is 5-25 mass% when the total of the A component and the matrix polymer B component is 100 mass%. COPYRIGHT: (C)2009,JPO&INPIT |
申请公布号 |
JP2009155577(A) |
申请公布日期 |
2009.07.16 |
申请号 |
JP20070338094 |
申请日期 |
2007.12.27 |
申请人 |
UMG ABS LTD |
发明人 |
TEZUKA KOICHI;FUJIMOTO IWAO;NAKAMOTO MASAHITO |
分类号 |
C08L55/02;C08L25/12;C08L63/00;C08L67/00;C08L69/00;C25D5/56 |
主分类号 |
C08L55/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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