| 摘要 |
PROBLEM TO BE SOLVED: To provide a piezoelectric device of which plane size is reduced. SOLUTION: A piezoelectric device is configured by mounting a piezoelectric vibrating reed 12 in a package. The piezoelectric vibrating reed 12 includes a through-part 22, which passes through one principal surface 18 and another principal surface 20, inside its outer shape. A wire conducting a mount electrode 16b provided on the one principal surface 18 and a pad electrode 36 provided on the package is passed through the through-part 22. Furthermore, a mount electrode 16b provided on the other principal surface 20 and a package-side mount electrode 34 provided on the package comprise conductive bonding materials to support the piezoelectric vibrating reed 12 at one point. COPYRIGHT: (C)2009,JPO&INPIT
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