| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for dicing a wafer into individual devices by easily and smoothly cutting the wafer from the backside along streets. SOLUTION: The method dices a wafer having device areas where devices are formed in a plurality of areas on the surface sectioned by a plurality of streets arranged in the shape of a grid, and peripheral surplus areas surrounding the device areas along the plurality of streets. The method includes: a step for sticking the surface side of the wafer to an adhesive tape and sticking the peripheral part of the adhesive tape to an annular frame; a step for forming street recognition marks on the backside of the adhesive tape; a step for detecting the street recognition marks from the surface side of the adhesive tape by sucking the surface side of the wafer by means of a chuck table; and a step for cutting the wafer along the streets based on the street recognition marks thus detected. COPYRIGHT: (C)2009,JPO&INPIT
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