发明名称 LASER MODULE
摘要 PROBLEM TO BE SOLVED: To provide a laser module capable of relaxing a stress when being implemented even if an intermediate body is not interposed between a laser array and a cooling body. SOLUTION: The laser module 10 includes a laser array 11 comprising a plurality of light emitting parts 13 and a cooling body 12 comprising a laser mounting region where the laser array 11 is mounted. In the laser mounting region of the cooling body 12, a plurality of grooves 21 are provided side by side in the same direction as the plurality of light emitting parts 13. A composite material 22, whose linear expansion coefficient is lower than the component material of the cooling body 12, is embedded in each of the grooves 21. The laser array 11 is positioned above the grooves 21 in which the composite materials 22 are embedded, being implemented on the cooling body 12. COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2009158645(A) 申请公布日期 2009.07.16
申请号 JP20070333694 申请日期 2007.12.26
申请人 SONY CORP 发明人 TAKIGUCHI YOSHIRO;NAGANUMA KO
分类号 H01S5/024 主分类号 H01S5/024
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