| 摘要 |
PROBLEM TO BE SOLVED: To provide a soldering device capable of suppressing the variation of heating in objects to be heated produced by the dimensional tolerance of the objects to be heated or the like and easily performing the soldering by a high-frequency induction heating system. SOLUTION: A core 20 is a C-type core, the end faces of which are opposed to each other and provided with a body part 20a having a U-shaped cross section and opposed end face parts 20b which are respectively provided successively to both ends of the body part 20a and extending in a direction in which the end faces approach each other so that the end faces are opposite to each other. A weight 17 as the object to be heated is situated between the opposed end faces 20c, 20d of the core 20. The weight 17 is heated by high-frequency induction heating with high-frequency induction heating coils 21 and semiconductor devices 12 are soldered by melting a solder in a metallic circuit of a circuit board 11. COPYRIGHT: (C)2009,JPO&INPIT |
