| 发明名称 |
INTEGRATED CIRCUIT PACKAGE-ON-PACKAGE STACKING SYSTEM |
| 摘要 |
An integrated circuit package-on-package stacking method includes forming a leadframe interposer including: forming a leadframe having a lead; forming a molded base only supporting the lead; and singulating the leadframe interposer from the leadframe.
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| 申请公布号 |
US2009179312(A1) |
申请公布日期 |
2009.07.16 |
| 申请号 |
US20090409491 |
申请日期 |
2009.03.24 |
| 申请人 |
MERILO DIOSCORO A;KUAN HEAP HOE;ONG YOU YANG;CHOW SENG GUAN;ASOY MA SHIRLEY |
发明人 |
MERILO DIOSCORO A.;KUAN HEAP HOE;ONG YOU YANG;CHOW SENG GUAN;ASOY MA. SHIRLEY |
| 分类号 |
H01L23/495;H01L21/50 |
主分类号 |
H01L23/495 |
| 代理机构 |
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