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发明名称
Thermische Kühlung eines industriellen Elektronikmoduls durch eine leitfähige Struktur
摘要
申请公布号
DE602007001222(D1)
申请公布日期
2009.07.16
申请号
DE200760001222T
申请日期
2007.09.27
申请人
ROCKWELL AUTOMATION TECHNOLOGIES INC.
发明人
SCHULTZ, RONALD E.;HALL, KENWOOD H.;HERBERT, PATRICK C.;BODMANN, DOUGLAS R.;KILLIAN, DANIEL E.
分类号
H05K7/20
主分类号
H05K7/20
代理机构
代理人
主权项
地址
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