| 摘要 |
<P>PROBLEM TO BE SOLVED: To miniaturize or make slim a light emitting device which linearly emits light. <P>SOLUTION: The light emitting device includes a metal base body (21) wherein a wiring pattern is formed through an insulating layer in length direction, having a concave crosssectional shape with the wiring pattern at the inside, a plurality of light emitting diode chips (11, 12 and 13) which are serially mounted by utilizing the wiring pattern, on the bottom surface in the concave crosssectional plane, and a sealing material (41) for sealing a plurality of mounted light emitting diode chips. The wiring pattern is formed both on the bottom surface (21BTM) in the concave crosssectional plane and on the side surfaces (21SDR and 21SDL). The wiring pattern formed on the bottom surface and that formed on the side surfaces are connected by one ends to be arrayed side by side in length direction. The metal base body functions, along with a wiring substrate, as a reflecting plate. The wiring pattern is formed on both of bottom surface and side surfaces in the concave crosssectional plane, which contributes to provide a slimmer metal base body compared with the case of forming it only on the bottom surface. <P>COPYRIGHT: (C)2009,JPO&INPIT |
