发明名称 METHODS AND DEVICES FOR WIRELESS CHIP-TO-CHIP COMMUNICATIONS
摘要 <p>Wireless chip-to-chip communications are methods and devices are disclosed. In an example, a wireless chip-to-chip communication device includes a plurality of chips, each of the plurality of chips having at least one antenna and formed on a multilayered structure. The multi-layered structure includes first and second absorption layers. The first and second absorption layers are configured to enclose a propagation medium having a given dielectric constant. The plurality of chips are configured to wirelessly communicate with each other via the respective antennas in accordance with a given wireless communication protocol via a direct propagation path within the propagation medium.</p>
申请公布号 WO2009089354(A2) 申请公布日期 2009.07.16
申请号 WO2009US30445 申请日期 2009.01.08
申请人 QUALCOMM INCORPORATED;CHUNG, WOO CHEOL 发明人 CHUNG, WOO CHEOL
分类号 H04B1/38 主分类号 H04B1/38
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