| 发明名称 |
Resin composition, heat-resistant resin paste and semiconductor device using these and method of preparing the same |
| 摘要 |
There are disclosed a resin composition comprising (A) a heat-resistant resin soluble in a solvent at room temperature, (B) a heat-resistant resin which is insoluble in a solvent at room temperature but becomes soluble by heating, and (C) a solvent; a heat-resistant resin paste further containing (D) particles or liquid state material D showing rubber elasticity; and a semiconductor device using the same and a method for producing the same. |
| 申请公布号 |
US7560307(B2) |
申请公布日期 |
2009.07.14 |
| 申请号 |
US20060403810 |
申请日期 |
2006.04.14 |
| 申请人 |
HITACHI CHEMICAL COMPANY, LTD. |
发明人 |
YANO YASUHIRO;MATSUURA HIDEKAZU;NOMURA YOSHIHIRO;MORISHITA YOSHII;SAKATA TOUICHI;NISHIZAWA HIROSHI;TANAKA TOSHIAKI;YASUDA MASAAKI;KANEDA AIZOU |
| 分类号 |
H01L21/50;G03F7/038;H01L21/31;H01L21/312;H01L21/44;H01L21/469;H01L21/4763;H01L21/48;H01L21/768;H01L23/532 |
主分类号 |
H01L21/50 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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