| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a silver-plating method, which does not need to form an unnecessary layer of a nickel layer inbetween a substrate which is difficult to be plated and a silver-plated film, and can form the silver-plated film having sufficient adhesiveness directly on the substrate which is difficult to be plated with the use of a halide-free plating bath under a satisfactory working environment. <P>SOLUTION: The silver-plating method is used for forming the silver-plated film on the substrate on which an oxide film is easily formed and the oxide film hinders the adhesiveness of a plated film, and comprises at least the steps of: (A) degreasing the substrate; (B) removing the oxide film with a strongly acidic solution; and subsequently to the step (B), (C) plating the substrate with silver by using a phosphine-containing acidic silver-plating bath which essentially does not contain a halide ion and a cyanide ion while skipping a step of nickel strike plating or nickel-alloy strike plating. <P>COPYRIGHT: (C)2009,JPO&INPIT</p> |
