发明名称 SEMICONDUCTOR APPARATUS
摘要 <p><P>PROBLEM TO BE SOLVED: To adjust chip characteristics by setting a program with e-fuse even after molding, with a simple configuration using no laser device, being smaller in footprint of a chip. <P>SOLUTION: The semiconductor apparatus has a simple configuration such as a single capacitor 11 and three transistors 12-14. After molding, e-fuse21 is programmed by generating a program voltage higher than a normal operation voltage in a packaged state of a final product, so that a trimming adjusting signal F is outputted to allow adjusting of chip characteristics. In a test mode, a power source circuit 10A for program operates for programming the e-fuse21, with no other circuits operating. So, the capacitor 11 constituting the power source circuit 10A for program can be also used as a capacitor of a circuit other than the power source circuit for program, in a normal operation mode except for the test mode. <P>COPYRIGHT: (C)2009,JPO&INPIT</p>
申请公布号 JP2009152325(A) 申请公布日期 2009.07.09
申请号 JP20070327965 申请日期 2007.12.19
申请人 SHARP CORP 发明人 NANBA KAZUHIDE;DOI HIROKI;FURUKABU TOSHIAKI
分类号 H01L21/822;H01L21/82;H01L27/04;H02M3/07 主分类号 H01L21/822
代理机构 代理人
主权项
地址