| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method of forming a photomask, capable of reducing the cost needed for manufacturing a semiconductor device. <P>SOLUTION: Design data of a wafer pattern to be formed on a semiconductor wafer is converted into mask data corresponding to a mask pattern 2 to be formed on a photomask 1 used for forming the wafer pattern, and the mask pattern 2 is formed on the photomask 1 on the basis of the mask data. A code pattern 7 obtained by coding information of the data conversion process of converting the design data into the mask data is formed on the photomask 1. <P>COPYRIGHT: (C)2009,JPO&INPIT |
