发明名称 CONNECTION STRUCTURE BETWEEN SIGNAL TERMINAL AND SIGNAL LINE CONDUCTOR, ELECTRONIC COMPONENT MOUNTING PACKAGE, AND ELECTRONIC APPARATUS
摘要 PROBLEM TO BE SOLVED: To obtain a connection structure between a signal terminal and a signal line conductor, which is capable of achieving good operability of an electronic component at a high frequency by reducing reflection loss at the time of input/output of a high frequency signal regardless of increase in high frequency. SOLUTION: A signal terminal 2 made of a linear conductor for transmitting a high frequency signal and a signal line conductor 1b which is in contact with a bottom of a step part 1e which is formed in an end part of one principal surface of a wiring board 1 and has the bottom lower than the principal surface, and is formed on the principal surface of the wiring board 1 up to the step part 1e are consecutively disposed on one line without vertically not overlapping when viewed from the principal surface side, and the signal terminal and the wiring board are disposed so as to overlap when viewed from the side surface side of the wiring board and are connected with a brazing filler metal 3. Since the increase in thickness of the signal line conductor 1b in the connection part can be suppressed, mismatching of characteristic impedance in the connection part is small and the reflection loss of the high frequency signal is reduced. COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2009152520(A) 申请公布日期 2009.07.09
申请号 JP20080075241 申请日期 2008.03.24
申请人 KYOCERA CORP 发明人 NAKAMICHI HIROYUKI
分类号 H01L23/12;H01S5/022 主分类号 H01L23/12
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