发明名称 METHOD AND STRUCTURE TO CONTROL THERMAL GRADIENTS IN SEMICONDUCTOR WAFERS DURING RAPID THERMAL PROCESSING
摘要 An article supports a workpiece during thermal processing. At least three elongated support members, e.g., support pins, extend upwardly from an element such as support arms for supporting the workpiece. Each of the support members includes a first portion adjacent to the workpiece. A second portion extends downwardly from the first portion. The first portion can have a thermal response faster than the thermal response of the workpiece and the second portion can have a slower thermal response. A removable element may be mounted to the support member for adjusting the thermal response of the support member. With removable elements, the support members can be adjusted to cause no net transfer of heat to or from the workpiece.
申请公布号 US2009175606(A1) 申请公布日期 2009.07.09
申请号 US20080970693 申请日期 2008.01.08
申请人 INTERNATIONAL BUSINESS MACHINES CORPORATION 发明人 BEZAMA RASCHID J.;GOLDMANN LEWIS S.;WALL DONALD R.
分类号 H01L21/67 主分类号 H01L21/67
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