发明名称 SEMICONDUCTOR DEVICE MANUFACTURING METHOD
摘要 <p>An impurity region is formed on a front surface section of a substrate by doping the substrate with impurity by exposing the substrate to plasma composed of a gas containing the impurity. A prescribed plasma doping time within a time range where a deposition rate on the substrate by plasma is higher than 0nm/min but not higher than 5nm/min is used.</p>
申请公布号 WO2009084130(A1) 申请公布日期 2009.07.09
申请号 WO2008JP02420 申请日期 2008.09.03
申请人 PANASONIC CORPORATION;SASAKI, YUICHIRO;OKASHITA, KATSUMI;NAKAMOTO, KEIICHI;MIZUNO, BUNJI 发明人 SASAKI, YUICHIRO;OKASHITA, KATSUMI;NAKAMOTO, KEIICHI;MIZUNO, BUNJI
分类号 H01L21/265;H01L21/22 主分类号 H01L21/265
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