| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a through substrate having improved solder connection reliability by reducing the influence of irregularities by glass cloth in the through substrate where wiring provided on both of the front and rear of the substrate made of prepreg is allowed to conduct electricity by a through-hole penetrating the substrate in a thickness direction. <P>SOLUTION: The through substrate is provided with: a substrate section 10 made of the prepreg 13 where resin 12 is impregnated to the glass cloth 11; a laminar surface-layer section 20 made of prepreg provided by laminating both of the front and rear of the substrate section 10; and the through-hole 50 that penetrates the substrate section 10 and the surface layer section 20 and electrically connects surface-layer wiring 40 and inner-layer wiring 30. Yarn 11a for composing the glass cloth 11 of the surface-layer section 20 is flatter than yarn 11a for composing the glass cloth 11 of the substrate section 10, and the outer surface of the surface-layer section 20 has irregularities smaller than those on the surface of the prepreg 13 for composing the substrate section 10. <P>COPYRIGHT: (C)2009,JPO&INPIT</p> |
