发明名称 |
RESIN COMPOSITION AND APPLICATION THEREOF |
摘要 |
A resin composition contains a solvent and a solid content dispersed in the solvent. The solid content does not contain phenolic resin. The solid content contains a benzoxazine resin and a phosphorus-containing epoxy resin. The weight ratio of the benzoxazine resin to phosphorus-containing epoxy resin is about 0.6:1 to about 3.0:1. A circuit board substrate and a copper clad laminate fabricated with the resin composition mentioned above are disclosed too.
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申请公布号 |
US2009176104(A1) |
申请公布日期 |
2009.07.09 |
申请号 |
US20090348483 |
申请日期 |
2009.01.05 |
申请人 |
CHEN LI-CHUN;CHEN JENG-I;WENG BILL |
发明人 |
CHEN LI-CHUN;CHEN JENG-I;WENG BILL |
分类号 |
B32B27/18;B32B15/092;B32B17/10;C08L63/00 |
主分类号 |
B32B27/18 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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