| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a method for controlling the temperature of an object to be compressed in initial stage heating to a suitable level (lower or higher than about 70°C) of 80°C or lower when a substrate for a printed circuit board is manufactured using a multiplaten press, and even when heating vapor is used as a heat source. <P>SOLUTION: When a plurality of sets of multi-layer structures of a prepreg and a metallic foil sequentially laminated from its inner side in this order are stacked, heated and integrally compressed with vapor as the heat source is trapped between press heat platens; initial stage heating is carried out intermittently to repeat injection and stop of vapor at a temperature of 100-140°C; and middle- and latter-stage heating is carried out continuously with vapor at temperatures of 150-200°C. Thus, in the end half of the latter stage heating, the temperature of the object to be compressed is increased to a level which thermosetting resin contained in the object reaches its setting temperature to completely set the resin, thereby manufacturing a substrate for a printed circuit board. <P>COPYRIGHT: (C)2005,JPO&NCIPI</p> |
