| 摘要 |
<p>A wiring board has a substrate having a first surface and a second surface opposite to the first surface, at least one wiring layer being formed between the first surface and the second surface. A non-through hole is formed in the substrate with a depth from the first surface to reach the wiring layer, an inner surface of the non-through hole being plated. A vent hole is formed in the substrate to extend between an end of the non-through hole and the second surface of the substrate. A plated portion of the non-through hole is connected to the wiring layer. An inner diameter of the vent hole is smaller than an inner diameter of the plated portion of the non-through hole.</p> |
