Modular cooling system and thermal bus for high power electronics cabinets
摘要
A modular cooling system (10) is provided for use in an electronics enclosure (12) mounting a plurality of heat generating electronic components (14). The cooling system (10) includes a cooling liquid supply manifold (16), a cooling liquid return manifold (18), and a plurality of cooling modules (20) that are selectively mountable into the electronic enclosure (12). The cooling system (10) also includes a wall (64) fixed in the enclosure to separate the electronic components (14) from the manifolds (16,18) to shield the electronic components (14) from any of the cooling liquid (52) should it leak from the system (10).
申请公布号
EP1298975(B1)
申请公布日期
2009.07.08
申请号
EP20020021333
申请日期
2002.09.20
申请人
MODINE MANUFACTURING COMPANY
发明人
MEMORY, STEVEN B.;GANAWAY, FREDERICK E.;ROGERS, JAMES C.;DEVUONO, ANTHONY;PHILLIPS, ALFRED;ZUO, ZHIJUN