SEMICONDUCTOR MODULE AND METHOD OF MANUFACTURING THE SAME

摘要

A semiconductor module and a manufacturing method thereof are provided to prevent a crack of an external connection terminal by surrounding an external surface of a semiconductor package with a PCB(Printed Circuit Board). A semiconductor module(100) includes a PCB(110), a semiconductor package(120), an electrode pattern(132,134), an insulating layer pattern(142,144) and an outer connector(150). The PCB has an internal space. The semiconductor package is received in an internal space of the PCB to be electrically connected to the PCB. The electrode pattern is formed on the surface of the PCB in order to be electrically connected to the PCB. The insulating layer pattern is formed on the surface of the PCB. An opening is formed in the insulating layer pattern in order to partly expose the electrode pattern. The opening is connected to the internal space of the PCB. The external connection terminal electrically connects the PCB and the semiconductor package. The external connection terminal includes a solder ball.