发明名称 Contact structure and method of forming the same
摘要 In a method of forming a contact structure, first and second conductive structures may be formed on a lower structure to be spaced from each other. An insulating layer may be formed on the lower structure to cover the first and second conductive structures. A first hole exposing the first conductive structure may be formed through the insulating layer. A spacer may be formed on a sidewall of the first hole. A first contact electrically coupled to the first conductive structure may be formed in the first hole having the sidewall on which the spacer is formed. A portion of the insulating layer located between the spacers may be removed to form a second hole exposing the second conductive structure. A second contact electrically coupled to the second conductive structure may be formed in the second hole.
申请公布号 US7557026(B2) 申请公布日期 2009.07.07
申请号 US20070711118 申请日期 2007.02.27
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 KIM JONG-KYU;JEONG SANG-SUP;CHOI SUNG-GIL;YOON KUK-HAN;KIM BUM-SOO
分类号 H01L21/44 主分类号 H01L21/44
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