SLURRY FOR CHEMICAL MECHANICAL POLISHING AND METHOD OF MANUFACTURING THE SAME

摘要

Chemical mechanical polishing slurry is provided to minimize micro scratch in manufacturing an integrated semiconductor by removing macro particles from abrasive particles, and to improve polishing rate and polishing selectivity. A method for manufacturing chemical mechanical polishing slurry comprises the steps of: (S100) mixing abrasive particles, solvent and dispersing agent to prepare a mixture for producing slurry; (S110) milling a mixture for producing the slurry; (S120); filtering the mixture for producing the milled slurry; inputting the mixture for producing the filtered slurry in an aging vessel; (S130) aging the mixture for producing the slurry; and (S140) rotating the aged vessel.